Methods and apparatus for drying a substrate
US8635784B2 · kind B2 · utility
4Cited by
111References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2006 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Mar 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67034
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a first aspect, a method of drying at least a portion of a substrate located within a fluid is provided. The method includes contacting an edge of the substrate that is located within the fluid with a pusher pin. The pusher pin has (a) a shaft portion; and (b) a tip portion having a knife edge of a width of 0.42 inches or less, the tip portion adapted to contact and support the substrate with the knife edge. The method further includes lifting the substrate from the fluid with the pusher pin; and exposing the substrate to a drying vapor as the substrate is lifted from the fluid. Numerous other aspects are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.