Solder interconnect with non-wettable sidewall pillars and methods of manufacture
US8637392B2 · kind B2 · utility
8Cited by
12References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2010 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Apr 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.