Methods of testing packaged thin-film piezoelectric-on-semiconductor microelectromechanical resonators having hermetic seals
US8638178B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2012 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Apr 26, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/241
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Methods of testing packaged thin-film piezoelectric-on-semiconductor (TPoS) microelectromechanical resonators having hermetic seals include measuring a quality factor (Q) of resonance of the packaged resonator at at least two unequal temperatures to determine whether a ΔQ/ΔT is significantly different (e.g, by at least 50%) over a temperature range (ΔT) spanning a smallest and largest of the at least two temperatures. These measurements are performed for a packaged resonator having a QAIR<QTED, where QAIR is the quality factor of resonance of the packaged resonator due to air damping and QTED is the quality factor of resonance of the packaged resonator due to thermoelastic damping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.