Heating device for testing integrated components
US8642925B2 · kind B2 · utility
1Cited by
19References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 6, 2007 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Sep 22, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2875
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A heating device for testing integrated components is disclosed. In one embodiment, an inner casing is arranged in the heating device surrounding a holding chamber. The inner casing contains at least one recess in which an electrically conductive contact device is moveably arranged. This permits contact to be reliably made with a circuit to be tested. If the inner casing is of compact design, there is a very homogeneous temperature distribution in the heating device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.