Micro-electro-mechanical-system sensor and method for making same
US8643128B2 · kind B2 · utility
1Cited by
7References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 24, 2009 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Jun 16, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0714
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention discloses an MEMS sensor and a method for making the MEMS sensor. The MEMS sensor according to the present invention includes: a substrate including an opening; a suspended structure located above the opening; and an upper structure, a portion of which is at least partially separated from a portion of the suspended structure; wherein the suspended structure and the upper structure are separated from each other by a step including metal etch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.