Inventor · Hsinchu, TW

Chuan-Wei Wang

52Patents
6h-index
17Co-inventors
65Inventor score

Filing activity: Nov 2, 2006 → Nov 26, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US7785481B2 Method for fabricating micromachined structures Performing Operations; Transporting 27 Active
US8368005B2 Optical detection method and optical MEMS detector, and method for making MEMS detector Physics 20 Active
US8836761B2 3D information generator for use in interactive interface and method for 3D information generation Electricity 17 Active
US9618610B2 Time of flight system capable of increasing measurement accuracy, saving power and/or increasing motion detection rate and method thereof Physics 16 Active
US7759256B2 Micro-electro-mechanical system device and method for making same Performing Operations; Transporting 12 Active
US8524519B2 MEMS microphone device and method for making same Electricity 7 Active
US8003422B2 Micro-electro-mechanical system device and method for making same Performing Operations; Transporting 6 Active
US7412888B2 Accelerometer Physics 6 Active
US8828771B2 Sensor manufacturing method Electricity 4 Active
US9491531B2 Microphone device for reducing noise coupling effect Electricity 3 Active
US8479576B2 MEMS device and deformation protection structure therefor and method for making same Emerging Cross-Sectional Technologies 3 Active
US8183650B2 MEMS device and MEMS spring element Performing Operations; Transporting 3 Active
US8071413B2 Micro-electro-mechanical system (MEMS) sensor and method for making same Performing Operations; Transporting 3 Active
US8426934B2 Micro-electro-mechanical system device and method for making same Performing Operations; Transporting 2 Active
US8459115B2 MEMS accelerometer with enhanced structural strength Physics 2 Active
US8371167B2 In-plane sensor, out-of-plane sensor, and method for making same Physics 2 Active
US8513041B2 MEMS integrated chip and method for making same Electricity 1 Active
US8372675B2 Microelectronic device and fabricating method thereof and MEMS package structure and fabricating method thereof Electricity 1 Active
US8424383B2 Mass for use in a micro-electro-mechanical-system sensor and 3-dimensional micro-electro-mechanical-system sensor using same Physics 1 Active
US8952463B2 MEMS structure preventing stiction Performing Operations; Transporting 1 Active
US8692338B2 Micro electronic device having CMOS circuit and MEMS resonator formed on common silicon substrate Performing Operations; Transporting 1 Active
US8643128B2 Micro-electro-mechanical-system sensor and method for making same Performing Operations; Transporting 1 Active
US9018718B2 Micro-electro-mechanical-system device with guard ring and method for making same Electricity 1 Active
US7989247B2 In-plane sensor and method for making same Physics 1 Active
US8117919B2 Micro-electro-mechanical system device Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.