Multi-channel package and electronic system including the same
US8643175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2012 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Jul 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-channel package has at least four channels and includes a package substrate having a first surface and a second surface, semiconductor chips mounted on the first surface of the package substrate, and external connection terminals disposed on the second surface of the package substrate and electrically connected to the semiconductor chips by the at least four channels. Each channel is dedicated to one or a group of the chips. An electronic system includes a main board, at least one such multi-channel package mounted on the main board, and a controller package that is mounted on the main board, has 4n channels (wherein n≧2) and controls the at least one multi-channel package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.