Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector

US8643188B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thilo Stolze · Arnsberg, DE
• Olaf Kirsch · Erwitte, DE

Key dates

• Filing date: Jun 3, 2011
• Grant date: Feb 4, 2014
• Expiry date: Jul 30, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49147
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side and a top side spaced apart from the bottom side in a vertical direction. The at least one semiconductor chip is arranged on the top side. Each one of the first connecting elements has a first end which protrudes away from an insulation carrier of the substrate in a direction perpendicular to the vertical direction. The semiconductor system further includes a connecting system with a number of N≧1 connectors. A first one of the connectors includes at least two electrically conductive second connecting elements. Each one of the second connecting elements has a first end. The first end of each one of the first connecting elements is electrically conductively connectable to the first end of one of the second connecting elements.