High reliability laser emitter modules
US8644357B2 · kind B2 · utility
4Cited by
83References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2011 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Jul 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments are directed to laser emitter modules, or subassemblies thereof, and methods and devices for making or using the modules. Some module embodiments are configured to provide hermetically sealed enclosures that are thermally stable during use, highly reliable in adverse environments, convenient and cost effective to manufacture or any combination of the foregoing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.