Noise coupling reduction and impedance discontinuity control in high-speed ceramic modules
US8645889B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2012 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Jul 31, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method reduces coupling noise and controls impedance discontinuity in ceramic packages by: providing at least one reference mesh layer; providing a plurality of signal trace layers, with each signal layer having one or more signal lines and the reference mesh layer being adjacent to one or more of the signal layers; disposing a plurality of vias through the at least one reference mesh layer, with each via providing a voltage (Vdd) power connection or a ground (Gnd) connection; selectively placing via-connected coplanar-type shield (VCS) lines relative to the signal lines, with a first VCS line extended along a first side of a first signal line and a second VCS line extended along a second, opposing side of said first signal line. Each of the VCS lines interconnect with and extend past one or more vias located within a directional path along which the VCS lines extends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.