Semiconductor device and method of manufacturing the same
US8648455B2 · kind B2 · utility
1Cited by
0References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 1, 2011 |
| Grant date | Feb 11, 2014 |
| Priority date | — |
| Expiry date | Sep 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a wiring substrate having an insulating film formed on a surface thereof, a first semiconductor chip mounted on the wiring substrate, and a second semiconductor chip stacked and mounted on the first semiconductor chip so as to form an overhang portion. The insulating film is removed from an area of the wiring substrate that faces the overhang portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.