Trim magnets to adjust erosion rate of cylindrical sputter targets
US8652310B2 · kind B2 · utility
4Cited by
6References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 24, 2008 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Aug 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3461
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A cylindrical magnetron sputtering apparatus includes a rotating cylindrical sputtering target, a non-rotating magnet structure within the cylindrical sputtering target and at least one non-rotating trim magnet adjacent an end of the magnet structure. The trim magnets are manipulated during operation of the apparatus to alter a magnetic field produced by the magnet structure within the cylindrical sputtering cathode. As a result the shape of a racetrack discharge plasma formed at an end of the sputtering target is altered such that the formation of an erosion groove is avoided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.