Method for use in making electronic devices having thin-film magnetic components
US8652856B2 · kind B2 · utility
2Cited by
21References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2013 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Mar 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N50/01
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a method of forming electronic device having thin-film components by using trenches. One or more of thin-film components is formed by depositing a thin-film in the trench followed by processing the deposited thin-film to have the desired thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.