Method for heat dissipation on semiconductor device
US8653357B2 · kind B2 · utility
10Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2013 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Feb 25, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device and method wherein a thermo electric generator device is disposed between stacks of a multiple level device, or is provided on or under a die of a package and is conductively connected to the package. The thermo electric generator device is configured to generate a voltage by converting heat into electric power. The voltage which is generated by the thermo electric generator can be recycled back into the die itself, or to a higher-level unit in the system, even to a cooling fan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.