Integrated circuit package with multiple dies and bundling of control signals
US8653638B2 · kind B2 · utility
1Cited by
12References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2010 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Dec 24, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A package includes a first die and a second die, at least one of said first and second dies being a memory. The dies are connected to each other through an interface. The interface is configured to transport a plurality of control signals. The number of control signals is greater than a width of the interface. At least one of the first and second dies performs a configurable grouping so as to provide a plurality of groups of control signals. The signals within a group are transmitted across the interface together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.