In-situ backside cleaning of semiconductor substrate
US8657963B2 · kind B2 · utility
7Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2011 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Nov 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a method and apparatus for cleaning a semiconductor wafer. In an embodiment of the method, a single wafer cleaning apparatus is provided and a wafer is positioned in the apparatus. A first chemical spray is dispensed onto a front surface of the wafer. A back surface of the wafer is cleaned while dispensing the first chemical spray. The cleaning of the back surface may include a brush and spray of cleaning fluids. An apparatus operable to clean the front surface and the back surface of a single semiconductor wafer is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.