Mold chase design for package-on-package applications
US8658464B2 · kind B2 · utility
7Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2011 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Nov 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes placing a mold chase over a bottom package, wherein the bottom package has a connector at a top surface of the bottom package. The mold chase includes a cover, and a pin under and connected to the cover. The pin occupies a space extending from a top surface of the connector to the cover. A polymer is filled into a space between the cover of the mold chase and the bottom package. The polymer is then cured. After the step of curing the polymer, the mold chase is removed, and the connector is exposed through an opening in the polymer, wherein the opening is left by the pin of the mold chase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.