Ultrathin buried die module and method of manufacturing thereof
US8658473B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2012 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Aug 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a buried die module includes providing an initial laminate flex layer and forming a die opening through the initial laminate flex layer. A first uncut laminate flex layer is secured to the first surface of the initial laminate flex layer via an adhesive and a die is positioned within the die opening of the initial laminate flex layer. A second uncut laminate flex layer is secured to the second surface of the initial laminate flex layer via an adhesive and the adhesive between each pair of neighboring layers is cured. A plurality of vias and metal interconnects are formed in and on the first and second uncut laminate flex layers, with each of the metal interconnects extending through a respective via and being directly metalized to a metal interconnect on the initial laminate flex layer or a die pad on the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.