Scott Smith
12Patents
3h-index
15Co-inventors
53Inventor score
Filing activity: May 6, 2008 → Jun 9, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8586172B2 | Protective coating with high adhesion and articles made therewith | Emerging Cross-Sectional Technologies | 15 | Active |
| US8658473B2 | Ultrathin buried die module and method of manufacturing thereof | Electricity | 5 | Active |
| US8653670B2 | Electrical interconnect for an integrated circuit package and method of making same | Electricity | 5 | Active |
| US8623699B2 | Method of chip package build-up | Electricity | 2 | Active |
| US9299647B2 | Electrical interconnect for an integrated circuit package and method of making same | Electricity | 2 | Active |
| US9236348B2 | Ultrathin buried die module and method of manufacturing thereof | Electricity | 0 | Active |
| US8829690B2 | System of chip package build-up | Electricity | 0 | Active |
| US9666516B2 | Electronic packages and methods of making and using the same | Electricity | 0 | Active |
| US9679837B2 | Electrical interconnect for an integrated circuit package and method of making same | Electricity | 0 | Active |
| US10161233B2 | Method of upgrading and recovering a hydrocarbon resource for pipeline transport and related system | Fixed Constructions | 0 | Active |
| US10068840B2 | Electrical interconnect for an integrated circuit package and method of making same | Electricity | 0 | Active |
| US9570376B2 | Electrical interconnect for an integrated circuit package and method of making same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.