Patent · US Active

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

US8659146B2 · kind B2 · utility

2Cited by

12References

19Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Robert Bauer · San Diego, US
Anton Kolbeck · Lindenberg im Allgäu, DE

Key dates

Filing date	Jun 11, 2010
Grant date	Feb 25, 2014
Priority date	—
Expiry date	Nov 17, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and apparatus are provided for manufacturing a lead frame based, over-molded semiconductor package (7) with an exposed pad or power die flag (70) having multiple integrated THT heat spreader pins (71) configured for insertion into one or more vias (77) formed in a printed circuit board (78). The through hole heat spreader pins (71) may be formed as an integral part of the exposed pad (52) or may be solidly connected with the exposed pad (62).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.