Integrated circuit device with interconnects arranged parallel to each other and connected to contact via, and method for manufacturing same
US8659159B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 20, 2011 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Dec 22, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, an integrated circuit device includes a plurality of interconnects and a contact via. The plurality of interconnects are arranged parallel to each other. The contact via is connected to the each of the interconnects. A protrusion is formed at a portion of each of the interconnects connected to the contact via to protrude in a direction of the arrangement. A recess is formed at a portion of the each of the interconnects separated from the portion having the protrusion to recede in the direction. The protrusion formed on one interconnect of two mutually-adjacent interconnects among the plurality of interconnects is opposed to the recess formed in one other interconnect of the two mutually-adjacent interconnects. The portion having the recess is separated from portions on two sides thereof and is separated also from the portion having the protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.