RFID tag assembly methods
US8661652B1 · kind B1 · utility
16Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2012 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Apr 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.