Conditioner of chemical mechanical polishing apparatus
US8662956B2 · kind B2 · utility
6Cited by
21References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 3, 2011 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Feb 13, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided are a conditioner of a chemical mechanical polishing apparatus for polishing a substrate over a platen pad that rotates and a method thereof. The conditioner includes a disk holder, a piston rod, a housing, and a load sensor. The disk holder secures a conditioning disk that finely cuts a surface of the platen pad. The piston rod delivers a normal force to the disk holder. The housing covers at least a portion of the piston rod. The load sensor is installed to receive the normal force that the piston rod delivers to the piston rod and measuring the normal force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.