Method for making a thin-film element
US8664084B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2006 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Sep 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2007
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making a thin-film element includes epitaxially growing a first crystalline layer on a second crystalline layer of a support where the second crystalline layer is a material different from the first crystalline layer, the first crystalline layer having a thickness less than a critical thickness. A dielectric layer is formed on a side of the first crystalline layer opposite to the support to form a donor structure. The donor structure is assembled with a receiver layer and the support is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.