Semiconductor die package and method for making the same
US8664752B2 · kind B2 · utility
5Cited by
85References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2012 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Jun 12, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.