Power module package and method for manufacturing the same
US8664755B2 · kind B2 · utility
3Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2011 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Sep 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.