Mounting structure of semiconductor package component and manufacturing method therefor
US8664773B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2012 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | May 30, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity η1 and a thixotropy index T1 at a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity η2 and a thixotropy index T2 so that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30≦η2≦η1≦300 (Pa·s) and 3≦T2≦T1≦7, and sectional area S1 of the first adhesive part and sectional area S2 of the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S1≦S2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.