Wafer-scale package including power source

US8666505B2 · kind B2 · utility

Assignee

• Medtronic, Inc. · US

Inventors

• Richard J. O'Brien · Minneapolis, US
• John K. Day · Chandler, US
• Paul F. Gerrish · Phoenix, US
• Michael F. Mattes · Chandler, US
• David A. Ruben · Mesa, US
• Malcolm Grief · Boise, US

Key dates

• Filing date: Jan 28, 2011
• Grant date: Mar 4, 2014
• Expiry date: Jul 28, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19105
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.