Apparatus and method for predictive temperature correction during thermal processing
US8669497B2 · kind B2 · utility
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5References
26Claims
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Key dates
| Filing date | Mar 30, 2007 |
| Grant date | Mar 11, 2014 |
| Priority date | — |
| Expiry date | Aug 29, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67259
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal processing apparatus and method with predictive temperature correction. Distances are measured from a backside of the wafer relative to a reference plane. Heat is transferred to the backside of the substrate in relation to the measured distances. This allows a baking unit to uniformly heat the substrate to compensate for irregularities or warpage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.