Power lamp package
US8669572B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2005 |
| Grant date | Mar 11, 2014 |
| Priority date | — |
| Expiry date | Jun 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
Abstract
Adhesive-free assembly of the substrate and reflector components of a semiconductor die package is achieved by injection molding the reflector onto a surface of the substrate or by molding the reflector separate from the substrate and securing it in place on the substrate through deformation of a portion of the reflector. The reflector may be made reflective either by molding the reflector using a light scattering material or through the addition of a reflective element, such as a piece of foil material that is secured to the reflector. A variety of interchangeable reflective elements having different surface shapes, and thus different light reflecting properties, may be made.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.