Wiring board, semiconductor device, and method for manufacturing wiring board
US8669643B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 17, 2012 |
| Grant date | Mar 11, 2014 |
| Priority date | — |
| Expiry date | Jul 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09581
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring board includes a silicon substrate with a through hole communicating with first and second substrate surfaces. A capacitor includes a capacitor part mounted on an insulating film covering the substrate first surface and including a first electrode on the insulating film, a first dielectric layer on the first electrode, and a second electrode on the first dielectric layer. A multilayer structure arranged on a wall surface defining the through hole includes the insulating film on the through hole wall surface, a first metal layer on the insulating film formed from the same material as the first electrode, a second dielectric layer on the first metal layer formed from the same material as the first dielectric layer, and a second metal layer on the second dielectric layer formed from the same material as the second electrode. The multilayer structure covers a penetration electrode in the through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.