Crosstalk-free WLCSP structure for high frequency application
US8669658B2 · kind B2 · utility
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3References
11Claims
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Key dates
| Filing date | Jul 24, 2007 |
| Grant date | Mar 11, 2014 |
| Priority date | — |
| Expiry date | Sep 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure, a system, and a method for manufacture of crosstalk-free wafer level chip scale packaging (WLCSP) structure for high frequency applications is provided. An illustrative embodiment comprises a substrate on which various layers and structures form circuitry, a signal pin formed on the substrate and coupled with the circuitry, a ground ring encircling the signal pin, and a grounded solder bump coupled to the ground ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.