Method of manufacturing a circuit board
US8673391B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2013 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Apr 9, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/3065
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a circuit board is described herein. The method may include adding a resin, forming first and second fiberglass fibers, and forming first and second signal line traces capable of transmitting electrical signals. In some examples, a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace. In some examples, the first and second fiberglass fibers diagonally cross near the first and second signal line traces. In some examples, the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.