Method and apparatus for substrate-mask alignment
US8673791B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
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Key dates
| Filing date | May 25, 2012 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Sep 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02636
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A shadow masking device for use in the semiconductor industry includes self-aligning mechanical components that permit shadow masks to be exchanged while maintaining precise alignment with the target substrate. The misregistration between any two of the various layers in the formed structure can be kept to less than 40 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.