Dielectric separator layer
US8674484B2 · kind B2 · utility
0Cited by
5References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2008 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Sep 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/1047
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention describes a method including: providing a substrate; stacking interlevel dielectric layers over said substrate, and separating said interlevel dielectric layers with a dielectric separator layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.