Patent · US Active

Semiconductor packages with lead extensions and related methods

US8674487B2 · kind B2 · utility

5Cited by
36References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 15, 2012
Grant dateMar 18, 2014
Priority date—
Expiry dateMar 15, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/181
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A semiconductor package with a die pad, a die disposed on the die pad, and a first lead disposed about the die pad. The first lead includes a contact element, an extension element extending substantially in the direction of the die pad, and a concave surface disposed between the contact element and the extension element. A second lead having a concave surface is also disposed about the die pad. The first lead concave surface is opposite in direction to the second lead concave surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.