System and method for fine pitch PoP structure
US8674496B2 · kind B2 · utility
5Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2012 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Feb 22, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fine pitch package-on-package (PoP), and a method of forming, are provided. The PoP may be formed by placing connections, e.g., solder balls, on a first substrate having a semiconductor die attached thereto. A first reflow process is performed to elongate the solder balls. Thereafter, a second substrate having another semiconductor die attached thereto is connected to the solder balls. A second reflow process is performed to form an hourglass connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.