Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
US8674502B2 · kind B2 · utility
0Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2010 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Aug 3, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0665
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.