Inventor · Tsukuba, JP

Tetsuya Enomoto

29Patents
8h-index
51Co-inventors
78Inventor score

Filing activity: Oct 13, 1987 → Mar 10, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US6747610B1 Stereoscopic image display apparatus capable of selectively displaying desired stereoscopic image Electricity 78 Expired
US5739844A Method of converting two-dimensional image into three-dimensional image Electricity 40 Expired
US6553184B1 Method of converting two dimensional images into three-dimensional images Electricity 27 Expired
US5825997A Apparatus for producing a three dimensional image from a two dimensional image Electricity 21 Expired
US7439991B1 Image information presentation system, image information presentation method, medium storing image information presentation system program, and signal therefor Physics 18 Expired
US6336210B1 Panel-presentation-software creation method, computer-readable record medium recording a panel-presentation-software creation program, and panel-presentation-software creation device Physics 17 Expired
US7205645B2 Wiring board, semiconductor device, and method of manufacturing wiring board Electricity 8 Expired
US8034659B2 Production method of semiconductor device and bonding film Electricity 8 Active
US6133683A Color cathode ray tube having an internal voltage divider Electricity 4 Expired
US7488521B2 Resinous tube Emerging Cross-Sectional Technologies 3 Expired
US9431314B2 Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device Electricity 2 Active
US7907232B2 Liquid crystal display device Physics 2 Active
US11487201B2 Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component Physics 1 Active
US9024455B2 Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device Electricity 1 Active
US9129898B2 Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device Electricity 1 Active
US12336434B2 Piezoelectric film layered structure and method for producing thereof Electricity 0 Active
US11807721B2 Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component Physics 0 Active
US9123734B2 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device Electricity 0 Active
US12294832B2 Microelectromechanical systems device Electricity 0 Active
US8674502B2 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device Electricity 0 Active
US4894531A Photodetector for receiving an index signal of a beam-index cathode-ray tube Electricity 0 Expired
US12294831B2 Electroacoustic transducer Electricity 0 Active
US8028402B2 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof Emerging Cross-Sectional Technologies 0 Active
US11048167B2 Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component Chemistry; Metallurgy 0 Active
US10725379B2 Polymide precursor resin composition Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.