Multiple iteration substrate printing
US8678534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2011 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | May 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0091
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A system and a method for printing a desired pattern on a substrate, the method may include: receiving or generating printing instructions for printing multiple patterns during multiple printing iterations, wherein at least two different printing iterations are expected to be executed by different sets of nozzles of an array of nozzles, wherein a superposition of the multiple patterns is expected to differ from the desired pattern by a tolerable difference even when a nozzle of the array of nozzles malfunctions; and printing the multiple patterns during multiple printing iterations, wherein at least two different printing iterations are expected to be executed by different sets of nozzles of the array of nozzles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.