Aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a CMP process

US8679980B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Vijay Immanuel Raman · Mannheim, DE
• Ilshat Gubaydullin · Ludwigshafen, DE
• Yuzhuo Li
• Mario Brands · Ludwigshafen, DE
• Yongqing Lan · Potsdam, US

Key dates

• Filing date: Apr 19, 2010
• Grant date: Mar 25, 2014
• Expiry date: Aug 6, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

(A) solid polymer particles being finely dispersed in the aqueous phase and containing pendant functional groups (a1) capable of strongly interacting and forming strong complexes with the metal of the surfaces to be polished, and pendant functional groups (a2) capable of interacting less strongly with the metal of the surfaces to be polished than the functional groups (a1); and (B) an organic non-polymeric compound dissolved in the aqueous phase and capable of interacting and forming strong, water-soluble complexes with the metal of the surfaces to be polished and causing an increase of the material removal rate MRR and the static etch rate SER of the metal surfaces to be polished with increasing concentration of the compound (B); a CMP process comprising selecting (A) and (B) and the use of the CMP agent and process for polishing wafers with ICs.