Yongqing Lan
18Patents
2h-index
28Co-inventors
46Inventor score
Filing activity: Apr 19, 2010 → Nov 12, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8679980B2 | Aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a CMP process | Electricity | 3 | Active |
| US9765239B2 | Use of a chemical-mechanical polishing (CMP) composition for polishing a substrate or layer containing at least one III-V material | Electricity | 2 | Active |
| US10899945B2 | Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt comprising substrates | Electricity | 2 | Active |
| US10385236B2 | Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates | Electricity | 2 | Active |
| US9828527B2 | Chemical-mechanical polishing compositions comprising N,N,N′,N′-tetrakis-(2-hydroxypropyl)-ethylenediamine or methanesulfonic acid | Electricity | 1 | Active |
| US11264250B2 | Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates | Chemistry; Metallurgy | 0 | Active |
| US10214663B2 | Chemical-mechanical polishing composition comprising organic/inorganic composite particles | Electricity | 0 | Active |
| US8747687B2 | Aqueous polishing agent comprising solid polymer particles and two complexing agents and its use in a process for polishing patterned and unstructured metal surfaces | Electricity | 0 | Active |
| US9028708B2 | Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this process | Chemistry; Metallurgy | 0 | Active |
| US10090159B2 | Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of N-vinyl-homopolymers and N-vinyl copolymers | Electricity | 0 | Active |
| US10227506B2 | Chemical mechanical polishing (CMP) composition for high effective polishing of substrates comprising germanium | Electricity | 0 | Active |
| US11993729B2 | Chemical mechanical polishing composition | Electricity | 0 | Active |
| US10407594B2 | Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine | Electricity | 0 | Active |
| US10738219B2 | Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates | Chemistry; Metallurgy | 0 | Active |
| US10392531B2 | Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this process | Electricity | 0 | Active |
| US10570316B2 | Chemical mechanical polishing (CMP) composition | Chemistry; Metallurgy | 0 | Active |
| US11286402B2 | Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates | Electricity | 0 | Active |
| US9862862B2 | Chemical-mechanical polishing compositions comprising polyethylene imine | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.