Coplanar waveguide for stacked multi-chip systems
US8680689B1 · kind B1 · utility
7Cited by
11References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 4, 2012 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Oct 4, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/028
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An approach for a coplanar waveguide structure in stacked multi-chip systems is provided. A method of manufacturing a semiconductor structure includes forming a first coplanar waveguide in a first chip. The method also includes forming a second coplanar waveguide in a second chip. The method further includes directly connecting the first coplanar waveguide to the second coplanar waveguide using a plurality of chip-to-chip connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.