Platen ground pin for connecting substrate to ground
US8681472B2 · kind B2 · utility
0Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2009 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Jun 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2007
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Techniques for reducing particle contamination on a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a ground pin that extends two regions of a platen that support the substrate. The ground pin may comprise a pin body; and a sleeve comprising an upper portion, a side portion, and a lower portion, the sleeve being configured to fit around the pin body, the sleeve including a fluid channel configured to transport fluid between the upper portion and the lower portion of the sleeve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.