Wafer level packaged MEMS device
US8685776B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2010 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Jul 7, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/036
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for sensor architecture based on bulk machining of silicon wafers and fusion bond joining which provides a nearly all-silicon, hermetically sealed, microelectromechanical system (MEMS) device. An example device includes a device sensor mechanism formed in an active semiconductor layer and separated from a handle layer by a dielectric layer, and a silicon cover plate having a handle layer with a dielectric layer being bonded to portions of the active layer. Pit are included in one of the handle layers and corresponding dielectric layers to access electrical leads on the active layer. Another example includes set backs from the active components formed by anisotropically etching the handle layer while the active layer has been protectively doped.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.