Peter H. LaFond
8Patents
4h-index
7Co-inventors
46Inventor score
Filing activity: Jun 16, 1992 → Dec 10, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7238999B2 | High performance MEMS packaging architecture | Electricity | 27 | Expired |
| US7469588B2 | MEMS vertical comb drive with improved vibration performance | Physics | 15 | Expired |
| US5287744A | Accelerometer with flexure isolation | Physics | 10 | Expired |
| US8685776B2 | Wafer level packaged MEMS device | Performing Operations; Transporting | 9 | Active |
| US7350415B2 | Closed-loop comb drive sensor | Physics | 2 | Expired |
| US7516661B2 | Z offset MEMS device | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7720661B2 | Low vibration rectification in a closed-loop, in-plane MEMS device | Physics | 1 | Active |
| US7949508B2 | Low vibration rectification in a closed-loop, in-plane MEMS device | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.