Flank wettable semiconductor device
US8685795B2 · kind B2 · utility
12Cited by
25References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 3, 2012 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | May 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flank wettable semiconductor device is assembled from a lead frame or substrate panel by at least partially undercutting the lead frame or substrate panel with a first cutting tool to expose a flank of the lead frame and applying a coating of tin or tin alloy to the exposed flank prior to singulating the lead frame or substrate panel into individual semiconductor devices. The method includes electrically interconnecting lead frame flanks associated with adjacent semiconductor devices before applying the coating of tin or tin alloy. The lead frame flanks may be electrically interconnected during wire bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.