Thermally and electrically enhanced ball grid array package
US8686558B2 · kind B2 · utility
7Cited by
144References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2011 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Sep 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a method for assembling a ball grid array (BGA) package is provided. The method includes providing a stiffener that has opposing first and second surfaces, wherein the first surface is capable of mounting an integrated circuit (IC) die in a central area and forming a pattern in at least a portion of the first surface to enhance the adhesiveness of an encapsulant material to the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.