Integrated circuit manufacturing system
US8689434B2 · kind B2 · utility
0Cited by
6References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 14, 2009 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Feb 6, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An ICs modeling manufacturing procedure is disclosed. A first pattern is printed on a first surface of a printed circuit board (PCB). The first pattern includes a first barcode and a plurality of production codes. A plurality of elements are disposed on the first surface of the PCB. The PCB is heated to fix the elements on the first surface and secure the first pattern on the first surface of the PCB. When the first pattern is read, a first production information is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.