Chuck and a method for supporting an object
US8690135B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2007 |
| Grant date | Apr 8, 2014 |
| Priority date | — |
| Expiry date | Jul 6, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a chuck that includes a supporting element that is connected to a closing element. An upper surface of the supporting element includes a chemically etched zone and an un-etched zone. The chemically etched zone includes multiple upper areas that are surrounded by trenches. At least one pressurized gas conduit is formed in the supporting element so as to enable pressurized gas provided to a lower surface of the supporting element to propagate through the trenches. The un-etched zone is shaped in response to a shape of an object to be placed on the supporting element. The un-etched zone reduces pressurized gas leakage from the un-etched zone and the closing element reduces pressurized gas leakage from a lower surface of the supporting element when the object is placed on the chuck in alignment with the un-etched zone and pressurized gas is provided to the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.